Electronics and Optoelectronics
Optoelectronic Semiconductor Technology
Electronic and optoelectronic packaging technology
Technology/Patent
Summary
◆This technology include a high-level thermal analysis tool (ThermalMeter), DRAM Area, Performance, and Timing tool (DArT). The thermalMeter can exploit fine grain thermal result of 3D IC in a very short run time. DArT provides multiple choices for different DRAM layout configurations which help exploration of optimum DRAM array architecture. DArT also generates high-level models for system-level simulation automatically.
◆ITRI designed test vehicle of 3D IC, which included a stacking of logic and memory IC; and that is the first 90nm 3D IC on 12” wafer in Taiwan. These efforts strive Taiwan 3D IC R＆D activities, and will make the healthy ecosystem.
Data category
Technology
Data ID
S11204I0043
Owner
Industrial Technology Research Institute(工業技術研究院)
Owner attribute
Research institution
Technology Maturity
Trial production
Sales Period (Start)
2023/04/10
Transaction method
Patent_exclusive license,Patent_non-exclusive license,Joint development,Negotiate by self,
Effective date of publication
2025/04/13