Electronics and Optoelectronics
Optoelectronic Semiconductor Technology
Electronic and optoelectronic packaging technology
Technology/Patent
Summary
Emerging technologies for advanced packaging：
◆Sensor fusion
◆High frequency antenna and device packaging
◆Hybrid bonding
◆Embedded power packaging
Applications driving high speed transmission multi-chips and high performance computing：
◆Smart phone
◆Smart camera
◆High speed transmission computer
◆AI device
Data category
Technology
Data ID
S11204I0034
Owner
Industrial Technology Research Institute(工業技術研究院)
Owner attribute
Research institution
Technology Maturity
Trial production
Sales Period (Start)
2023/04/10
Transaction method
Patent_exclusive license,Patent_non-exclusive license,Joint development,Negotiate by self,
Effective date of publication
2025/04/13