Electronics and Optoelectronics
Optoelectronic Semiconductor Technology
Electronic and optoelectronic packaging technology
Technology/Patent
Summary
◆The thinning fine pitch interposer is embedded into existing IC carriers through bump-free interconnection and create an innovative IC heterogeneous integrated carrier architecture (EMI, Embedded interposer carrier)
◆The next generation of high-grade 2.5D or 3DIC module thinning and reliability enhancement.
◆The peak temperature can be reduced to less than 250°C.
◆The overall packaging structure can be reduced the 2.5D package thickness by more than 50％, and achieve the target of 2μm/2μm line width/spacing.
◆Bumpless interconnecting technology can be applied to high performance chips with high density connections, and to copper-to-copper bonding technology for better reliability.
Data category
Technology
Data ID
S11204I0033
Owner
Industrial Technology Research Institute(工業技術研究院)
Owner attribute
Research institution
Technology Maturity
Trial production
Sales Period (Start)
2023/04/10
Transaction method
Patent_exclusive license,Patent_non-exclusive license,Joint development,Negotiate by self,
Effective date of publication
2025/04/13