Electronics and Optoelectronics
Optoelectronic Semiconductor Technology
Electronic and optoelectronic packaging technology
Technology/Patent
Summary
◆Based on the size and process framework of current IC carriers, ITRI’s Panel-level Fan-out Module Integration Technology features cross-field integration of the panel-level fan-out packaging design and process.
◆Besides upgrading the IC carrier industry, the technology makes it possible to embed 2 μm fine conduction lines in IC carriers for the PCB industry.
◆Currently adopted by manufacturers at home and abroad, this platform prepares IC carrier factories for offering packaging services to clients and allows material manufacturers to carry out packaging testing on fan-out packaging materials.
Data category
Technology
Data ID
S11204I0032
Owner
Industrial Technology Research Institute(工業技術研究院)
Owner attribute
Research institution
Technology Maturity
Trial production
Sales Period (Start)
2023/04/10
Transaction method
Patent_exclusive license,Patent_non-exclusive license,Joint development,Negotiate by self,
Effective date of publication
2025/04/13