Electronics and Optoelectronics
Optoelectronic Semiconductor Technology
Electronic and optoelectronic packaging technology
Technology/Patent
Summary
Well established mechanical simulation platform for FOPLP
◆Material property measurement for structure stress analysis
◆Structure stress ＆ warpage analysis for fan-out panel-level packaging
◆Sensitivity analysis of material parameter ＆ structure design
◆This warpage simulation design platform for the experimental design and process integration can afford ultra-low panel level RDL and IC package. ◆Package structure stress analysis can help engineers evaluate and select materials.
Data category
Technology
Data ID
S11204I0029
Owner
Industrial Technology Research Institute(工業技術研究院)
Owner attribute
Research institution
Technology Maturity
Trial production
Sales Period (Start)
2023/04/10
Transaction method
Patent_exclusive license,Patent_non-exclusive license,Joint development,Negotiate by self,
Effective date of publication
2025/04/13