Electronics and Optoelectronics
Optoelectronic Semiconductor Technology
Electronic and optoelectronic packaging technology
Technology/Patent
Summary
The panel level functional RDL with integrated devices can increase the integration level of advanced IC system in package.
Active Device:
Panel level LTPS-TFT technology with electroplating copper traces can form a electrostatic protection circuit, with discharge current ≧0.2A and speed ≦3 ns, to decease the damage from the charged device mode ESD in ICs assembly.
Passive Device:
Thin film elements and high aspect ratio copper wire can form functional circuits, such as RF filters. The resulting filter, with thin and small area (0.85 mm (W) × 0.5 mm (L) × 0.15 mm (H)), shows an insertion loss of 2.7dB at frequency 3.3~4.2GHz.
◆Functional RDL is value-added capability to panel-level RDL technology for advanced system in package
◆Functional RDL could be applied to high-end IC substrate and high-end probe cards for chip probing as well
Data category
Technology
Data ID
S11204I0028
Owner
Industrial Technology Research Institute(工業技術研究院)
Owner attribute
Research institution
Technology Maturity
Trial production
Sales Period (Start)
2023/04/10
Transaction method
Patent_exclusive license,Patent_non-exclusive license,Joint development,Negotiate by self,
Effective date of publication
2025/04/13